| 摘要 |
PROBLEM TO BE SOLVED: To enable a sticking foreign matter and pronged products which are two big elements of a failure mode to be removed, and further enhance a rate of operation in a measuring process which is a subsequent process thereof. SOLUTION: In a method for screening chip components in which chip components to be screened are fed to a screening container 20 having a screening hole capable of passing non-defective chip components on the bottom section thereof, the screening container 20 are vibrated by a vibration type part array machine 10 and the non-defective chip components are passed through the screening hole, the screening hole is provided with an upper side guide hole section, a square hole section which is continued to the upper side guide hole section and is narrow portion against the upper side guide hole section, and a lower side guide hole section continued in the downward direction of the square hole section. The screening hole is arranged so as to pass the non-defective chip components through an upper and a lower directions in a long posture, and block passing in a laterally long posture. COPYRIGHT: (C)2005,JPO&NCIPI
|
