发明名称 MULTILAYER CIRCUIT BOARD INCORPORATING CAPACITOR ELEMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a small-sized multilayer circuit board incorporating a small capacitor element which is excellent in connection reliability. <P>SOLUTION: The multilayer circuit board 11 incorporating a capacitor element is configured such that a plurality of insulating layers 1 consisting of an organic material are stacked each being provided with a wiring conductor 2 at a surface thereof, the conductors 2 each provided at upper and lower surfaces of the insulating layer 1 are electrically connected through a through conductor 3 formed in the insulating layer 1, and the capacitor element 8 formed by alternately stacking a number of electrode layers 6 and ceramic dielectric layers 7 is provided in a hollow portion 5 which is formed at least through one insulating layer 1. An insulating layer 1a where a through hole 5a serving as the hollow portion 5 is formed, comprises a liquid crystal polymer layer 9 and clad layers 10 consisting of an epoxy resin and formed at upper and lower surfaces of the liquid crystal polymer layer 9, with the total thickness of the clad layers 10 being larger than the thickness of the liquid crystal polymer layer 9. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005019686(A) 申请公布日期 2005.01.20
申请号 JP20030182581 申请日期 2003.06.26
申请人 KYOCERA CORP 发明人 NAGASAWA TADASHI;SERI TAKUJI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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