发明名称 |
THIN FILM DEPOSITION METHOD, THIN FILM MANUFACTURING APPARATUS, AND THIN FILM DEPOSITED BODY |
摘要 |
PROBLEM TO BE SOLVED: To provide a thin film deposition method, a thin film manufacturing apparatus, and a thin film deposited body in which a thin film of excellent water repellency and oil repellency can be deposited, and the film deposition efficiency is enhanced. SOLUTION: In the thin film deposition method, discharge gas is introduced in a discharge space and excited under atmospheric pressure or the pressure close to atmospheric pressure, the excited discharge gas is mixed with thin film deposition gas containing a raw material outside the discharge space to form secondary excitation gas, and a thin film is deposited on a base material by exposing the secondary excitation gas to the base material. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005015850(A) |
申请公布日期 |
2005.01.20 |
申请号 |
JP20030182594 |
申请日期 |
2003.06.26 |
申请人 |
KONICA MINOLTA HOLDINGS INC |
发明人 |
ARITA HIROAKI;KUDO KAZUYOSHI;SAITO ATSUSHI |
分类号 |
C23C16/452;H01L21/205;(IPC1-7):C23C16/452 |
主分类号 |
C23C16/452 |
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