| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board equipped with a resistor which is formed in its via and has a desired resistance value. SOLUTION: The method of manufacturing the printed wiring board comprises processes of forming a metal thin film, a photoresist pattern, and wiring metal (1); forming a resist (2); boring a hole in the resist at the via so as to expose the wiring metal (3); growing conduction metal in the hole by electrolytic plating (4); forming a resist thin film (5); boring a hole in the resist thin film at a resistor via to expose the wiring metal (6); growing a resistor metal in the hole by electrolytic plating (7); separating the photoresist pattern, the resist, and the resist thin film (8); separating the metal thin film (9); forming an insulating resin film (10); and polishing the surface so as to expose the conduction metal and the resistor (11). COPYRIGHT: (C)2005,JPO&NCIPI
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