发明名称 OPTICAL COMPONENT-MOUNTING SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND OPTICAL MODULE
摘要 PROBLEM TO BE SOLVED: To provide an optical component-mounting substrate which is capable of satisfactorily realizing miniaturization and low height without complicating the manufacturing process and has superior high frequency characteristics, and to provide a manufacturing method thereof and an optical module which is made highly functional by this method. SOLUTION: The component-mounting substrate is provided with an upper substrate 11 having an opening 14 for disposing optical components on its top surface, and a lower substrate 12 having a high position surface 12a and a low position surface 12b on its top surface. This substrate is formed by joining the bottom surface of the upper substrate 11 with the top surface of the lower substrate 12, in a state that a portion on the bottom surface of the upper substrate 11 where the opening 14 is provided may face the high position surface 12a or the low position surface 12b of the lower substrate 12. The method of manufacturing the same and the optical module employing this substrate are provided. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005019648(A) 申请公布日期 2005.01.20
申请号 JP20030181685 申请日期 2003.06.25
申请人 KYOCERA CORP 发明人 ODA KEIKO
分类号 G02B6/42;H01S5/022;(IPC1-7):H01S5/022 主分类号 G02B6/42
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