发明名称 |
MOLD COMPOUND CAP IN A FLIP CHIP MULTI-MATRIX ARRAY PACKAGE AND PROCESS OF MAKING SAME |
摘要 |
A molding compound cap structure is disclosed. A process of forming the molding compound cap structure is also disclosed. A microelectronic package is also disclosed that used the molding compound cap structure. A method of assembling a microelectronic package is also disclosed. A computing system is also disclosed that includes the molding compound cap structure. The molding compound cap includes a configuration that exposes a portion of microelectronic device. |
申请公布号 |
WO2005006433(A2) |
申请公布日期 |
2005.01.20 |
申请号 |
WO2004US20195 |
申请日期 |
2004.06.23 |
申请人 |
INTEL CORPORATION |
发明人 |
LEBONHEUR, VASSOUDEVANE;HARRIES, RICHARD |
分类号 |
H01L21/56;H01L23/31 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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