| 摘要 |
In a cooling system 1, an electronic component 2 transfers heat to a porous material 4 which is cooled by vaporisation of a coolant. The coolant may be applied to the interior and/or external surface of the porous material by spraying a jet 11, and the coolant may be delivered from a dispenser 5 which includes a valve 5a, in a pulsed flow, controlled by a control unit 8. The coolant delivery may be controlled by a temperature monitoring circuit 9 and/or dependant on the power driving the electronic component. The coolant may be a gas at ambient temperature, but stored under pressure 7, and may be delivered to the porous material from the dispenser 5 at less than ambient temperature. The porous material may be foam, which is made from or comprise a metal such as copper or aluminium, or a non-metal such as carbon or silicon, or a mixture of metal and non-metal. The foam may have a porosity of between 4 and 40 pores per centimetre which may retain coolant. Heat may be conducted from the electronic component to the porous material by a heat transfer member 3. The gas may be carbon dioxide, or a hydrofluorocarbon. The electronic component may be a semiconductor device, which may be radiation emitting, such as an optoelectronic laser or an LED. |
