发明名称 Integrated stacked capacitor and method of fabricating same
摘要 An integrated stacked capacitor comprises a first capacitor film (46) of polycrystalline silicide (poly), a second capacitor film (48) and a first dielectric (26) sandwiched between the first capacitor film (46) and second capacitor film (48). A second dielectric (34) and a third capacitor film (50) are provided. The second dielectric (34) is sandwiched between the second capacitor film (48) and third capacitor film (50). A method for fabrication of an integrated stacked capacitor comprises the following sequence of steps: applying a polysilicide layer (20) to form the first capacitor film (46); applying a first dielectric (26); applying a first metallization layer (28) to form the second capacitor film (48); applying a second dielectric (34); and applying a second metallization layer (34) to form the third capacitor film (50).
申请公布号 US2005006687(A1) 申请公布日期 2005.01.13
申请号 US20040850797 申请日期 2004.05.20
申请人 DIRNECKER CHRISTOPH;BABCOCK JEFFREY;BALSTER SCOTT 发明人 DIRNECKER CHRISTOPH;BABCOCK JEFFREY;BALSTER SCOTT
分类号 H01L21/02;H01L27/08;(IPC1-7):H01L27/108 主分类号 H01L21/02
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