发明名称 |
Electronic semiconductor device having a thermal spreader |
摘要 |
The electronic device is formed in a die including a body of semiconductor material having a first face covered by a covering structure and a second face. An integral thermal spreader of metal is grown galvanically on the second face during the manufacture of a wafer, prior to cutting into dice. The covering structure comprises a passivation region and a protective region of opaque polyimide; the protective region and the passivation region are opened above the contact pads for the passage of leads.
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申请公布号 |
US2005009300(A1) |
申请公布日期 |
2005.01.13 |
申请号 |
US20040893021 |
申请日期 |
2004.07.16 |
申请人 |
STMICROELECTRONICS S.R.L. |
发明人 |
MURARI BRUNO;MASTROMATTEO UBALDO;VIGNA BENEDETTO |
分类号 |
H01L23/31;H01L23/36;H01L23/373;H01L23/482;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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