| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chip-like electronic part which can be easily manufactured with high reliability at a low cost and highly functionalized, and to provide its manufacturing method and mounting structure. <P>SOLUTION: The method of manufacturing the chip-like electronic part comprises processes of fixing a plurality of semiconductor chips or a plurality of kinds of semiconductor chips on a board, depositing an insulating material on all the surface of the board including spaces among the semiconductor chips, separating a pseudo wafer where semiconductor chips are fixed from the board, boring a though-hole in the dicing area of the pseudo wafer of the insulating material penetrating through it in the direction of thickness, filling the through-hole with a conductive material, forming interconnect lines connected to conductive resins on both the surfaces of the pseudo wafer, and cutting the semiconductor chips to divide the board into separate chip-like electronic parts each having the conductive resin in the direction of thickness. The chip-like electronic part obtained by the manufacturing method is provided, and its manufacturing structure is also provided. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
