| 摘要 |
A laser hole boring apparatus comprising a galvanomirror beam scanning system, a DOE beam diffraction system and a selecting device for the two systems optionally. The DOE system bores many holes simultaneously on printed circuit boards or packages by converting a laser beam into two dimensional diffraction beams and converging the diffraction beams by an f sinθlens into spots on the object (board, package). The galvanomirror system bores many holes sequentially on printed circuit boards or packages by scanning a pulse laser beam in two dimensions and converging the scanned beam by an f sinθlens into a spot on the object. <IMAGE> |
