发明名称 Electroless deposition methods and systems
摘要 Methods and systems for depositing metal patterns on a substrate are provided. Accordingly, an electroless active layer can be formed on a substrate. Ink-jet techniques can then be used to independently ink-jet at least two components of an electroless deposition composition onto a variety of substrates. A metal composition can be ink-jetted onto the electroless active layer. The metal composition can contain a metal salt and optional additives. A reducing agent composition can be ink-jetted either subsequent to or prior to ink-jetting of the metal composition to form an electroless composition on the substrate. The metal salt and reducing agent react to form a metal pattern which can be used in formation of electronic devices or other products. The described ink-jettable compositions are stable over a wide range of conditions and allow for wide latitude in inkjet formulations and choice of substrates.
申请公布号 US2005006339(A1) 申请公布日期 2005.01.13
申请号 US20030618049 申请日期 2003.07.11
申请人 MARDILOVICH PETER;HEMAN GREGORY;PUNSALAN DAVID;BERHANE SAMSON 发明人 MARDILOVICH PETER;HEMAN GREGORY;PUNSALAN DAVID;BERHANE SAMSON
分类号 C23C18/16;C23C18/28;C23C18/40;C23C18/44;H05K3/18;(IPC1-7):B05D3/04;C23F1/00 主分类号 C23C18/16
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