| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure having high cooling performance and high reliability in structure cooling a heat generating element of an electronic device by liquid circulation. <P>SOLUTION: A water-cooling jacket 8 is thermally connected to the heat generating element 7. A radiating pipe 9 is thermally connected to a radiating board 10 installed on the back face of a display 2. A refrigerant liquid is circulated between the water cooling jacket 8 and the radiating pipe 9 by means of a liquid drive unit 11. The water-cooling jacket 8 is formed to jacket base channel integral structure by die-cast molding or water-cooling jacket piping channel integral structure by jacket base and metal pipe junction. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
