| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining method by which all smears can be removed while suppressing damages to a base metal layer, and a laser beam machining device. <P>SOLUTION: A substrate 1 to be machined, in which a via hole is formed to an insulating layer on the metal layer, is held to an XY table 2. The via hole of the substrate 1 to be machined is irradiated with pulse laser beams with a plurality of shots from a first laser beam source 31. A controller 4 transmits a trigger pulse signal S to the first laser beam source 31 so that the energy density on the irradiation face of the first one shot among the pulse laser beams with a plurality of the shots becomes larger than that of on the irradiation face of the last one shot. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
