| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for flip chip packaging wherein connection pads can be formed into a prescribed shape even if the connection pads formed on a mount substrate are arranged with a very narrow pitch, and hence a semiconductor element can be surely mounted. <P>SOLUTION: In the substrate for flip chip packaging whereon the semiconductor element equipped with metal bumps as connection electrodes is mounted by flip chip bonding, a plurality of conductor patterns 25, each of which is composed of a connection pad 22 joined by the metal bump and lead wires 24 connected to the connection pad 22, are arranged on a mounting face whereon the semiconductor element is to be mounted, at the same arrangement pitch as that of the metal bumps. The connection pad 22 formed in each conductor pattern 25 is extended only on one side of the conductor pattern 25 from one side edge thereof. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
