发明名称 |
Electronic package having controlled height stand-off solder joint |
摘要 |
<p>An electronic package (10) is provided which includes a circuit board (12) having a substrate (14) and circuitry (16) and a surface mount device (22) having a contact terminal (24). A mounting pad (28) is formed on the circuit board (12). The electronic package (10) also includes a solder joint (30) connecting the contact terminal (24) of the surface mount device (22) to the mounting pad (28) on the circuit board (12). The solder joint (30) includes a reflowable solder and a plurality of stand-off members (32 or 42). The stand-off members (32 or 42) provide a separation distance (H) between the circuit board (12) and surface mount device (22) in the range of about 0.01 mm to 0.10 mm.</p> |
申请公布号 |
EP1496733(A2) |
申请公布日期 |
2005.01.12 |
申请号 |
EP20040076923 |
申请日期 |
2004.07.02 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
STILLABOWER, MORRIS D. |
分类号 |
H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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