| 摘要 |
<p>There is described a method of assembling a printed circuit to a support, in particular to a dissipator. First, a printed circuit (10; 10'; 10''), and a support (20) having at least one main face (20a) by which to engage the printed circuit (10; 10'; 10''), are prepared. An intermediate layer (30) made of glass fibre impregnated with epoxy resin, and having a first face (30a) and an opposite second face (30b), is then positioned between the printed circuit (10; 10'; 10'') and the main face (20a) of the support (20). And finally, the first face (30a) of the intermediate layer (30) is placed in contact with the printed circuit (10; 10'; 10"), the second face (30b) of the intermediate layer (30) is placed in contact with the main face (20a) of the support (20), and the printed circuit (10; 10'; 10"), the intermediate layer (30), and the support (20) are then pressed together. <IMAGE></p> |
