发明名称 Method for fabricating embedded nonvolatile semiconductor memory cells
摘要 A method for fabricating embedded nonvolatile semiconductor memory cells is described. The method includes forming a first insulating layer on a substrate having a high-voltage region, a memory region and a logic region. The first insulating layer is removed in the memory region, and a second insulating layer is formed. A charge-storing layer is formed and patterned along with a third insulating layer. The first to third insulating layers and also the charge-storing layer are removed in the logic region. A fourth insulating layer is formed and a conductive control layer is formed and patterned.
申请公布号 US6841448(B2) 申请公布日期 2005.01.11
申请号 US20020045278 申请日期 2002.01.14
申请人 INFINEON TECHNOLOGIES AG 发明人 GEHRING OLIVER;LANGHEINRICH WOLFRAM
分类号 H01L21/28;H01L21/8246;H01L27/105;(IPC1-7):H01L21/823;H01L21/321 主分类号 H01L21/28
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