| 摘要 |
PURPOSE: A pressure sensor and a method fabricating the same are provided to reduce the size of a package by forming a compensation resistance on a silicon substrate. CONSTITUTION: A pressure sensor includes a silicon substrate(2), a resistance port, plural metal lines(6), and an electrode pad(8). The silicon substrate(2) has a flat shape and a groove formed thereon. The plural resistance ports are formed by performing ion implantation and diffusion with respect to the silicon substrate. The metal lines(6) connect the resistance ports to each other in the form of Wheatstone Bridge. The electrode pad(8) is formed at the end part of the metal lines(6). The entire surface of the silicon substrate has a compensation resistance connected to at least resistance ports in parallel.
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