发明名称 IMPEDANCE MATCHING CIRCUIT AND IMPEDANCE MATCHING METHOD OF CIRCUIT ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide an inexpensive and simple impedance matching circuit and an impedance matching method of a circuit element. <P>SOLUTION: Pads (17b-d) for impedance correction are provided on a soldering connection portion between a substrate 11 and a component 12 to perform impedance matching, and the position of a surface mounting component 18 to be mounted on a signal line 14b provided on the rear surface side of a dielectric layer 16 is adjusted to adjust a GND effect of a microstrip line, thereby realizing characteristic impedance matching on the connection portion of the circuit components by a combination of these. In this way, impedance adjustment can be realized only by a simple work such as soldering without requiring a special and distinct component for impedance adjustment. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005005788(A) 申请公布日期 2005.01.06
申请号 JP20030164041 申请日期 2003.06.09
申请人 SUMITOMO ELECTRIC IND LTD 发明人 MAEDA YOSHIHIKO
分类号 H01P3/08;H01P5/02;H03H7/38 主分类号 H01P3/08
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