| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus for ultrasonic bonding which can determine the fault of the apparatus certainly. <P>SOLUTION: The apparatus for ultrasonic bonding includes an oscillation circuit 11 which outputs an ultrasonic oscillation voltage; an amplifier 12 for amplifying an ultrasonic oscillation voltage output from this oscillation circuit and applying to a transducer 2; a phase corrector 14 for detecting a phase difference between the ultrasonic oscillation voltage to be output from the oscillation circuit and current fed back from the transducer to control the phase of the ultrasonic oscillation voltage; and determining means 17 set to an upper limit value and a lower limit value for comparing the phase difference, between the ultrasonic oscillation voltage to be output from the phase corrector and the current fed back from the transducer with the upper limit value and the lower limit value to determine whether an ultrasonic oscillation state is abnormal or not. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
