SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND PROCESS FOR FABRICATING SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To increase the clearance between a lead electrode extended radially and a bump electrode.

SOLUTION: Outer bump electrodes 42b' are arranged while being shifted from the staggered arrangement of inner bump electrodes 42a. The outer bump electrode 42b' is shifted to the position of a bump electrode 42b" and the bump electrodes 42a and 42b are provided, respectively, with a square bonding face.

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