APPARATUS AND METHOD FOR ATTACHING ADHESIVE TAPE FOR FABRICATING SEMICONDUCTOR CHIP PACKAGE TO IMPROVE PRODUCTIVITY OF SEMICONDUCTOR CHIP PACKAGE

摘要

PURPOSE: An apparatus for attaching adhesive tape for fabricating a semiconductor chip package is provided to improve productivity of a semiconductor chip package by rapidly performing a process for attaching adhesive tape to mount a semiconductor chip and by reducing the size of equipment. CONSTITUTION: Adhesive tape(20) of a predetermined size proper for mounting a chip(15a,15b) is consecutively disposed in a film(21) at a predetermined pitch. A tape reel(23,25) around which the film is wound is installed in an unpack unit(110). A tape binder winds the film from the tape reel by a predetermined length, separated from the unpack unit by a predetermined interval. A punch head(130) punches the adhesive tape of the film supplied from the tape reel and attaches the punched adhesive tape to a chip attach object, installed between the unpack unit and the tape binder.