SEMICONDUCTOR MODULE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND PROCESS FOR FABRICATING SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To bond bump electrodes to lead electrodes extended radially without being restricted by the arranging position of an alignment mark. SOLUTION: Alignment marks 11a and 11b are arranged on a film substrate 1 differently from arrangement of alignment marks 12a and 12b on a semiconductor chip 5. Expansion/contraction amount of the film substrate 1 is determined by measuring the distance between the alignment marks 11a and 11b and the semiconductor chip 5 is arranged on the film substrate 1 while being shifted on the basis of the expansion/contraction amount of the film substrate 1. COPYRIGHT: (C)2005,JPO&NCIPI