| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed circuit board which can accurately form a circuit pattern without being influenced by a dimensional change, etc. of a constituting material, and which can accurately connect a plurality of circuit patterns formed in multilayer in respective via holes. SOLUTION: The method for manufacturing the printed circuit board includes a step of forming a through hole 102 for a via and a through hole 103 for an alignment mark in an electric insulation base material 101, a step of filling up through holes 102, 103 with conductive pastes 104a, 104b, a step of laminating a wiring material 105 in the base material 101 except an alignment mark part, a step of electrically connecting a layer of the wiring material 105 by curing the base material 101 and the conductive pastes 104a, 104b by heating and pressurizing the base material 101 and the wiring material 105, a step of forming a photosensitive resist 107 on the front surface of the wiring material 105, a step of disposing a photomask 108 on the surface of the photosensitive resist 107 and aligning a photomask side alignment mark 110 with the alignment marks 103, 104b of the base material 101 exposed from the opening 106, and a step of forming circuit patterns 105a, 105b from the wiring material 105 through exposure and development. COPYRIGHT: (C)2005,JPO&NCIPI |
