| 摘要 |
A device for removing heat from an electronic component comprises a heat sink 214 that can be coupled to the electronic component to be cooled. The heat sink has fins 215 at angle to a plurality of cooling flow streams 216, 218, with each flow stream following a different path. The fins may be curved (415, Fig 4). The flow streams may be provided by fans 211, 212, which may at right angles to each other. |
