| 摘要 |
The ball grid array integrated circuit package has an outer two-dimensional array of solder balls and a central two-dimensional array of solder balls (34) on the base (16) of a package substrate. The two arrays have pads which are separated from each other by different distances. The two arrays are separated from each other by a third distance. The solder balls are typically reflowed to mount the package to a printed circuit board. An integrated circuit (18), coupled to the solder balls by internal routing within the package, is mounted on the opposite surface of the substrate. The outer array of balls is outside the dimensional profile of the integrated circuit, reducing solder stresses due to thermal expansion between integrated circuit and package. |
