| 发明名称 |
CIRCUIT MODULE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
<p>A board 11 having a quartz crystal 13 housed in a cavity 12 is prepared. Chips 14a to 14c are mounted on wiring conductors 20 disposed on a second main surface 11b of the board 11. An epoxy resin prepreg sheet 15a is stacked on the second main surface 11b of the board 11, heated, and pressure-bonded to form a resin layer 15 on the second main surface of the board 11. Accordingly, a circuit module that can be miniaturized in two dimensions and that ensures reliability and flexibility in establishing external connections and a method for manufacturing the same are provided.</p> |
| 申请公布号 |
EP1494285(A1) |
申请公布日期 |
2005.01.05 |
| 申请号 |
EP20030715470 |
申请日期 |
2003.03.27 |
| 申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
MORIYASU, AKIYOSHI;HARADA, JUN;TAKAGI, HIROSHI;YAMAMOTO, YUKI |
| 分类号 |
H01L21/56;H01L23/538;H03B5/36;H03H3/04;H03H9/05;H03H9/08;H03H9/10;H05K1/18;(IPC1-7):H01L25/16;H03H3/02;H03B5/32 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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