发明名称 Method of fabricating a high-voltage transistor with a multi-layered extended drain structure
摘要 A method for fabricating a high-voltage transistor with an extended drain region comprises forming an epitaxial layer (101) on a substrate (100), the epitaxial layer and the substrate being of a first conductivity type; then etching the epitaxial layer to form a pair of spaced-apart trenches that define first and second sidewall portions of the epitaxial layer. A dielectric layer (102) is formed that partially fills each of the trenches, covering the first and second sidewall portions. The remaining portions of the trenches are then filled with a conductive material (103) to form first and second field plate members that are insulated from the substrate and the epitaxial layer. <IMAGE>
申请公布号 US6838346(B2) 申请公布日期 2005.01.04
申请号 US20030722792 申请日期 2003.11.25
申请人 POWER INTEGRATIONS INC 发明人 DISNEY DONALD RAY
分类号 H01L29/786;H01L21/336;H01L27/04;H01L29/06;H01L29/40;H01L29/417;H01L29/423;H01L29/78;(IPC1-7):H01L21/336 主分类号 H01L29/786
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