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发明名称
具有屏蔽式镀通孔结构之基板及其形成方法
摘要
一种具有屏蔽式镀通孔结构之基板,包括一基板主体、一洞口、一金属屏蔽层、一介电层以及一讯号传输线路,其中该洞口系形成于该基板主体上,且该金属屏蔽层系覆盖于该洞口之内侧壁上,而该讯号传输线路系设置于该洞口中,并以该介电层而其该金属屏蔽层电气隔绝,用以传送一射频讯号;本发明亦提供一种形成该镀通孔结构之基板之方法。
申请公布号
TW200501386
申请公布日期
2005.01.01
申请号
TW092117623
申请日期
2003.06.27
申请人
日月光半导体制造股份有限公司
发明人
邱基综;吴松茂;陈正芬
分类号
H01L23/52
主分类号
H01L23/52
代理机构
代理人
花瑞铭
主权项
地址
高雄市楠梓区加工出口区经三路二十六号
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