发明名称 |
COPPER-NICKEL-SILICON TWO PHASE QUENCH SUBSTRATE |
摘要 |
<p>A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.</p> |
申请公布号 |
KR20040111637(A) |
申请公布日期 |
2004.12.31 |
申请号 |
KR20047018596 |
申请日期 |
2003.05.15 |
申请人 |
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发明人 |
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分类号 |
C22C9/06;B21J1/04;B21J5/00;B22D11/06;B22D21/00;C22F1/00;C22F1/08 |
主分类号 |
C22C9/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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