Method for forming storage node contact plug of semiconductor device

摘要

The present invention relates to a method for forming a storage node contact plug of a semiconductor device. The method includes the steps of: forming a bit line structure including a bit line and a hard mask on a substrate; forming a spacer made of an oxide material at sidewalls of the bit line structure; forming a line type photoresist pattern arranged in a direction vertical to the bit line structure on a storage node contact area of the substrate; forming an inter-layer insulation layer on an entire surface of the resulting structure including the line type photoresist pattern such that the inter-layer insulation layer is filled into a space between the photoresist pattern; etching an upper portion of the inter-layer insulation layer to expose the photoresist pattern; and removing the exposed photoresist pattern to open the storage node contact area.