发明名称 |
METHOD AND APPARATUS FOR THE APPLICATION OF POWDER MATERIAL TO SUBSTRATES |
摘要 |
There is provided and apparatus and method for electrostatically applying a powder material to substrates. The apparatus includes a plurality of platens , each platen being arranged to hold a plurality of substrates, a conveyor for conveying the platens along a path and an applicator for applying the powder material to the substrates. The method includes the steps of placing the substrates on platens, each platen holding a plurality of substrates, conveying the platens in series along a path and electrostatically applying a powder material to the substrates held on the platens. There is also provide d a platen for holding a plurality of substrates to which powder material is t o be electrostatically applied, the platen comprising a platen base having a plurality of supports for supporting a plurality of substrates and an electrically conducting platen shield located on the platen base and having a plurality of holes arranged to align with the plurality of supports on the platen base.
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申请公布号 |
CA2529435(A1) |
申请公布日期 |
2004.12.29 |
申请号 |
CA20042529435 |
申请日期 |
2004.06.17 |
申请人 |
PHOQUS PHARMACEUTICALS LIMITED |
发明人 |
IMPEY, BENJAMIN;JENNINGS, DOUGLAS;NEWMAN, MICHAEL;HALLETT, MARTIN;HENLEY, THOMAS |
分类号 |
B05B5/08;B05C13/02;B05D1/04;B05D1/06;B05D3/02 |
主分类号 |
B05B5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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