A MOLD SET FOR A SEMICONDUCTOR CHIP PACKAGE, WHICH CAN MEASURE THE EJECTING FORCE OF A MOLD RESIN FROM THE MOLD DIE SURFACE,申请号KR19970048084-传众专利搜索

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发明名称	A MOLD SET FOR A SEMICONDUCTOR CHIP PACKAGE, WHICH CAN MEASURE THE EJECTING FORCE OF A MOLD RESIN FROM THE MOLD DIE SURFACE
摘要
申请公布号	KR100465488(B1)	申请公布日期	2004.12.29
申请号	KR19970048084	申请日期	1997.09.22
申请人	SAMSUNG ELECTRONICS CO., LTD.	发明人	JUNG, YEONG DU;HWANG, CHAN SEUNG
分类号	H01L21/56;(IPC1-7):H01L21/56	主分类号	H01L21/56
代理机构		代理人
主权项
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