| 发明名称 |
Polyimide resin with reduced mold deposit |
| 摘要 |
<p>A polyimide composition and a process to prepare polyimide resins with reduced plate out and mold deposits is described. During resin molding operations the low plate out resins show a longer period of operation between cleaning of equipment leading to more efficient operation.</p> |
| 申请公布号 |
AU2004249690(A1) |
申请公布日期 |
2004.12.29 |
| 申请号 |
AU20040249690 |
申请日期 |
2004.06.10 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
ROY RAY OLDLE;ROBERT RUSSELL GALLUCCI;MARK ALAN SANNER;WILLIAM A. III KERNICK |
| 分类号 |
C08L79/08;C08G73/10 |
主分类号 |
C08L79/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
