发明名称 |
Three-dimensional integrated CMOS-MEMS device and process for making the same |
摘要 |
A vertically integrated structure includes a micro-electromechanical system (MEMS) and a chip for delivering signals to the MEMS. The MEMS has an anchor portion having a conductor therethrough, by which it is connected to a substrate. The chip is attached to the MEMS substrate in a direction normal to the substrate surface, so as to make a conductive path from the chip to the MEMS. The chip may be attached by bonding the conductor to C4 metal pads formed on the chip, or by bonding the conductor to metal studs on the chip. The MEMS substrate may be thinned before attachment to the chip, or may be removed from the underside of the MEMS. A temporary carrier plate is used to facilitate handling of the MEMS and alignment to the chip.
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申请公布号 |
US6835589(B2) |
申请公布日期 |
2004.12.28 |
申请号 |
US20020294140 |
申请日期 |
2002.11.14 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
POGGE H. BERNHARD;DESPONT MICHEL;DRECHSLER UTE;PRASAD CHANDRIKA;VETTIGER PETER;YU ROY |
分类号 |
B81C3/00;H01L21/768;(IPC1-7):H01L21/00 |
主分类号 |
B81C3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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