| 发明名称 |
Printed wiring board and method for manufacturing the same |
| 摘要 |
A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
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| 申请公布号 |
US6835895(B1) |
申请公布日期 |
2004.12.28 |
| 申请号 |
US19990319258 |
申请日期 |
1999.06.11 |
| 申请人 |
IBIDEN CO., LTD. |
发明人 |
ASAI MOTOO;HIRAMATSU YASUJI |
| 分类号 |
H05K1/02;H05K3/10;H05K3/24;H05K3/34;H05K3/38;H05K3/46;(IPC1-7):H05K1/03 |
主分类号 |
H05K1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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