发明名称 |
Electroforming apparatus and electroforming method |
摘要 |
An electroforming apparatus and an electroforming method that are capable of performing high-precision electroforming are provided. An electroforming tank 1 accommodated in an outer tank 2 is continuously supplied with an electrolyte 3 from a control tank 5, and electroforming is carried out in an overflow layer 10 of electrolyte 3 formed over the electroforming tank 1. A bus 25 for electroforming that is retained by a retaining jig 30 is carried along the overflow layer 10 by a jig transfer device 20. The electrolyte 3 overflowing the electroforming tank 1 is collected into a control tank 5 from the outer tank 2 and supplied to the electroforming tank 1 again after being filtered.
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申请公布号 |
US2004258860(A1) |
申请公布日期 |
2004.12.23 |
申请号 |
US20040487280 |
申请日期 |
2004.08.19 |
申请人 |
ODA TOKUJI;ITIKAWA YUTAKA |
发明人 |
ODA TOKUJI;ITIKAWA YUTAKA |
分类号 |
B23Q3/10;B23Q11/00;B23Q11/08;C25D1/02;C25D21/18;F15B15/26;(IPC1-7):F16L1/00;C25C7/00 |
主分类号 |
B23Q3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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