| 摘要 |
A description is given of a method for orienting a semiconductor wafer (W) during semiconductor fabrication with the aid of an optical alignment system (10), the semiconductor wafer (W) having an alignment mark (M) with regular structures (M1, M2, M3), on the basis of which the position of the semiconductor wafer (W) can be determined, having the following method steps: e) determination of a first position information item (x1, y1) of the alignment mark (M) in a predetermined direction (X, Y) with the aid of an optical measurement method that is optimized for position determination; f) determination of a line profile (SA) of the alignment mark (M) in the predetermined direction (X, Y) with the aid of an optical measurement method that is optimized for profile determination; g) determination of a second position information item (x2, y2) of the alignment mark (M) in the predetermined direction (X, Y), the first position information item (x1, y1) determined in method step a) being corrected with the aid of the line profile (SA) of the alignment mark determined in method step b); and use of the second position information item (x2, y2) of the alignment mark (M) for a positioning and/or a modeling of the semiconductor wafer (W).
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