| 摘要 |
A method for forming semiconductor device packages that include one or more semiconductor dice, leads in communication with bond pads of each die, and a protective layer, or package, over at least portions of the active surface of each die, and includes electrically exposing the leads through the protective layer so as to facilitate connection thereof to external circuitry. For example, external conductive structures may be secured to the leads through openings in the package. The package may also include protective layers over the back sides or the edges of each semiconductor die. The completed CSP device is precisely encapsulated with minimal lateral dimensions, and has an array of precisely positioned external connectors. A stereolithographic process is used for precisely forming the protective layers of the package. A machine vision system may be used in connection with stereolithographic equipment to locate individual dice, features thereof, or leads.
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