发明名称 |
METHOD AND SYSTEM FOR FABRICATING MULTI LAYER DEVICES ON A SUBSTRATE |
摘要 |
A method for fabricating multi layer active devices on a bulk substrate is disclosed. Multi layer microelectromechanical and microfluidic devices are fabricated on a substrate with layers of predetermined weak and strong bond regions where deconstructed layers of devices at or on the weak bond regions. Multi layer integrated circuits are fabricated on a substrate with layers of predetermined weak and strong bond regions is disclosed. An arbitrary number of layers can be bonded and stacked to create a predetermined device on the substrate. Also disclosed are methods of creating edge interconnects and vias through the substrate to form interconnections between layers and devices thereon. |
申请公布号 |
WO2004112089(A2) |
申请公布日期 |
2004.12.23 |
申请号 |
WO2003US37304 |
申请日期 |
2003.11.20 |
申请人 |
REVEO, INC.;FARIS, SADEG, M. |
发明人 |
FARIS, SADEG, M. |
分类号 |
G01R31/01;H01L21/66 |
主分类号 |
G01R31/01 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|