摘要 |
<p>A method of processing a substrate having a conductive material layer disposed thereon is provided which includes positioning the substrate in a process apparatus and supplying a first polishing composition between to the substrate. The polishing composition comprises phosphoric acid, at least one chelating agent, a corrosion inhibitor, a salt, an oxidizer, abrasive particulates, at least one pH adjusting agent to provide a pH from about 4 to about 7 and a solvent. The method further includes forming a passivation layer on the conductive material layer, removing the passivation layer to expose a portion of the conductive material layer, applying a first bias to the substrate, and removing at least about 50% of the conductive material layer. The method further includes separating the substrate from the first polishing composition, exposing the substrate to a second polishing composition and a second bias, and continuing to remove the conductive material layer.</p> |
申请人 |
APPLIED MATERIALS, INC.;LIU, FENG, Q.;CHEN, LIANG-YUH;TSAI, STAN, D.;DUBOUST, ALAIN;NEO, SIEW, S.;HU, YONGQI;WANG, YAN;BUTTERFIELD, PAUL, D. |
发明人 |
LIU, FENG, Q.;CHEN, LIANG-YUH;TSAI, STAN, D.;DUBOUST, ALAIN;NEO, SIEW, S.;HU, YONGQI;WANG, YAN;BUTTERFIELD, PAUL, D. |