发明名称 Method and system for cooling electronic components
摘要 A localized system for dissipating heat generated by an electronic component includes a controllable cooling element and a control system for controlling the cooling element. The control system adjusts a speed of operation of the cooling element in response to variations in power consumption of the electronic component.
申请公布号 US2004257013(A1) 申请公布日期 2004.12.23
申请号 US20030602972 申请日期 2003.06.23
申请人 CHHLEDA SACHIN NEVIN;BARSUN STEPHAN KARL;EPINOZA-IBARRA RICARDO E. 发明人 CHHLEDA SACHIN NEVIN;BARSUN STEPHAN KARL;EPINOZA-IBARRA RICARDO E.
分类号 H05K7/20;G06F1/20;G06F1/32;H02P7/00;(IPC1-7):H02P7/00 主分类号 H05K7/20
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