发明名称 |
Method and system for cooling electronic components |
摘要 |
A localized system for dissipating heat generated by an electronic component includes a controllable cooling element and a control system for controlling the cooling element. The control system adjusts a speed of operation of the cooling element in response to variations in power consumption of the electronic component.
|
申请公布号 |
US2004257013(A1) |
申请公布日期 |
2004.12.23 |
申请号 |
US20030602972 |
申请日期 |
2003.06.23 |
申请人 |
CHHLEDA SACHIN NEVIN;BARSUN STEPHAN KARL;EPINOZA-IBARRA RICARDO E. |
发明人 |
CHHLEDA SACHIN NEVIN;BARSUN STEPHAN KARL;EPINOZA-IBARRA RICARDO E. |
分类号 |
H05K7/20;G06F1/20;G06F1/32;H02P7/00;(IPC1-7):H02P7/00 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|