摘要 |
The invention relates to an optoelectronic component containing an optoelectronic chip (1), a chip carrier (2) with a central region (3), on which the chip is fixed and terminals (41, 42, 43, 44), which run from the central region of the chip carrier (2) to the exterior of said chip. The chip and sections of the chip carrier are surrounded by a body (5). The respective projection of the body, in addition to that of the longitudinal axes of the terminals on the contact plane between the chip and the chip carrier are essentially point-symmetrical in relation to the central point of the chip. The invention also relates to an assembly comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced malfunctions of the components is reduced. |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH;ARNDT, KARLHEINZ;BOGNER, GEORG;WAITL, GUENTER;WINTER, MATTHIAS |
发明人 |
ARNDT, KARLHEINZ;BOGNER, GEORG;WAITL, GUENTER;WINTER, MATTHIAS |