| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition for a memory card having excellent fluidity enabling it to well mold a thin-wall part and further having excellent heat resistance and impact resistance. <P>SOLUTION: The thermoplastic resin composition for a memory card is prepared by compounding (A) a polycarbonate resin, (B) an ABS resin, (C) a graft copolymer having a polycarbonate-based segment (a) chemically bonding a vinyl resin segment (b) forming a branched or crosslinked structure, (D) a crystalline resin and (E) a coloring agent which exhibits the weight loss of ≤3 mass% at 320°C and a heating rate of 10°C/min in a thermogravimetric analysis. The resin composition has an excellent fluidity to mold a thin-wall part, enabling it to provide a memory card which is allowed to have an excellent heat resistance with a high distortion temperature and also to have a high impact strength. <P>COPYRIGHT: (C)2003,JPO |
