MULTIDENTATE LIGAND, MULTI-NUCLEUS METAL COMPLEX, METAL COMPLEX CHAIN, METAL COMPLEX INTEGRATED STRUCTURE, AND PREPARATION METHOD THEREOF

摘要

An object of the present invention is typically to provide a metal complex assembly that is applicable to the miniaturization and elaboration of devices and apparatus in information and communication fields, such as arithmetic and logic units, displays and memories, and to provide a novel multidentate ligand which can be used as a suitable raw material for the metal complex assembly. <??>The present invention is as follows. A multidentate ligand includes at least two planar tetradentate coordination sites in one plane, each of the planar tetradentate coordination sites containing four nitrogen-containing groups of at least one of imino, amido and amino groups, and has the nitrogen atoms of the four nitrogen-containing groups as coordinating atoms in one plane. A metal complex assembly has one of two-dimensional and three-dimensional structures and contains metal complex chains and electroconductive wires, the metal complex chains each contain assembled metal complexes, the electroconductive wires each contain molecules serving as at least one of an acceptor and a donor, and the metal complex chains intersect with the electroconductive wires at such positions that the metal complexes and the molecules serving as at least one of an acceptor and a donor are capable of interacting with each other. <IMAGE>