METHOD FOR FORMING PATTERN OF PRINTED CIRCUIT BOARD FOR PREVENTING STATIC ELECTRICITY, INCLUDING STEPS OF ARRANGING SOLDER MASKS, EXPOSING COPPER PLATE, AND FORMING GROUND PORTION

摘要

PURPOSE: A method is provided to reduce impacts caused due to static electricity, by forming solder masks on a printed circuit board and exposing only a portion of a copper plate corresponding to the solder masks. CONSTITUTION: A method comprises a first step of arranging a plurality of pairs of solder masks(11) on a portion of an upper surface of a printed circuit board, corresponding to an electro-static discharge test position; a second step of exposing the solder masks to light such that a copper plate is exposed; and a third step of forming the entire of a lower surface of the printed circuit board including one of each of pairs of solder masks, into a ground portion, such that static electricity is eliminated when large amount of static electricity is suddenly introduced.