| 摘要 |
An optical circuit board comprising: a top face ( la), a bottom face (lb), an optical layer (9) buried between bottom and top faces, the optical layer being adapted to transmit optical signals, an opto-electronic component (15a, 15b) adapted to emit or receive light transmitted through the optical layer, a solid heat dissipative element (18) adapted to dissipate heat generated at the opto-electronic component. |
