| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for a solder resist having a low dielectric constant and ensuring a small dielectric loss even in a high-frequency domain. <P>SOLUTION: The resin composition for a solder resist contains (A) a polymer comprising a monomer unit derived from vinylbenzene and/or a derivative thereof and/or a monomer unit derived from vinylnaphthalene and/or a derivative thereof, (B) at least one compound selected from among the group comprising a cyanate ester resin, an oxetane-ring-containing compound, a divinylbenzene compound and a (vinylphenyl) vinyl ether compound, and (C) a cationic curing catalyst. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
