发明名称 METAL MASK FOR SPUTTERING
摘要 PROBLEM TO BE SOLVED: To provide a metal mask for sputtering, which does not give an adverse effect such as increase in an ohmic value due to moisture adsorbed in a resinous salient, to a transparent conductive film, even when the film is formed with the use of the metal mask provided with the resinous salient for sputtering. SOLUTION: The metal mask 20 used for forming a multilayerd transparent conductive film on a glass substrate by sputtering has the salient 23 of a resin containing 0.01 to 0.2% moisture on the surface contacting with the region other than an opening 21 of the glass substrate. The area of the salient is approximately 30% per unit area. The planar shape of the salient is a stripe shape. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004353021(A) 申请公布日期 2004.12.16
申请号 JP20030150486 申请日期 2003.05.28
申请人 TOPPAN PRINTING CO LTD 发明人 KUNO HISASHI;MINO SATORU
分类号 C23C14/04;C23C14/34;(IPC1-7):C23C14/04 主分类号 C23C14/04
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